ZSSC3123AI6C

DICE (WAFER SAWN) - FRAME

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RFQ
Specifications
Part Number:ZSSC3123AI6C
Manufacturer:Renesas Electronics Corporation
Description:DICE (WAFER SAWN) - FRAME
RoHs Status:
ROHS3 Compliant
Nkesp Part Number:73D-ZSSC3123AI6C
Part Status17949 pcs
Manufacturer:Renesas Electronics Corporation
Type:Capacitive Sensor
Supplier Device Package:Die
Series:cLite™
Package / Case:Die
Package:Tray
Output Type:I²C, SPI
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Input Type:Capacitive
Current - Supply:1.1 mA

In stock: 17949 pcs

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Product Comparison

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ManufacturerRenesasIDT, Integrated Device Technology IncRenesasIDT, Integrated Device Technology Inc
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Package-BulkBulkBulk
Package / Case----
Operating Temperature----
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